Agnitron’s New Showerhead: Advancing MOCVD Technology
Jan 31, 2024 · Volume 30 Issue 1. Agnitron’s New Showerhead: Advancing MOCVD Technology. A novel showerhead featuring innovative gas injection accelerates MOCVD growth while expanding the palette of epitaxial materials to include AlScN. BY AARON FINE, FIKADU ALEMA, WILL BRAND, VITALI SOUKHOVEEV, PAUL FABIANO …
Finwave unveils latest GaN-on-Si tech - News - Compound …
At MWC Barcelona, Finwave Semiconductor will unveil the newest performance benchmarks with its GaN-on-Si technology and high-power switches for infrastructure and handset applications. The company's enhancement-mode 200mm GaN-on-Si RF transistors, for example, have less than 1 ohm-mm on-resistance, low-knee voltage, > 700 mS/mm transconductance ...
Soitec and Resonac sign SmartSiC agreement - News
Sep 24, 2024 · The Japanese company Resonac (formerly Showa Denko) and France-based materials company Soitec have signed an agreement to develop 200mm (8-inch) SmartSiC SiC wafers using Resonac substrates and epitaxy processes, in a major step for the deployment of Soitec’s high-yielding SiC technology in Japan and other international markets.
Hybrid bonding: Going for GOLD - News - Compound …
Friday 3rd December 2021. Hybrid bonding provides attainable scaling for packaging of compound semiconductor devices in copper or gold. BY JOHN GHEKIERE FROM CLASSONE TECHNOLOGY. Fabricating semiconductor devices begins by growing epiwafers, with efforts directed at ensuring high-quality crystalline material with minimal imperfections.
Cubic boron arsenide - a perfect semiconductor? - News
Jul 25, 2022 · Researchers have experimentally discovered that a cubic boron arsenide crystal offers high carrier mobility for both electrons and holes – the two ways in which a charge is carried in a semiconducting material – suggesting a major advance for next-generation electronics. While earlier predictions had theorised that the crystal could exhibit ...
The secret sauce of silicon carbide wafer success - News
May 30, 2022 · Pureon continues to develop advanced wafer carriers and films for use in this process to extend the service life, resulting in improved cost of ownership. Pureon has also worked closely with the industry to bring two new polishing pads for SiC CMP to the market as recently presented at the 2021 ECSCRM in Tours, France.
$2.4B CS substrate market by 2027 - News - Compound …
Nov 14, 2022 · Driven by power and photonics applications, the compound semiconductor substrates market will be worth close to $2.4 billion by 2027 growing at 16 percent CAGR between 2021 and 2027, according to Yole Intelligence's new 'Status of Compound Semiconductors Industry 2022' report. CS has been adopted in many applications over the decades; more ...
Nexperia: Expanding GaN and SiC operations - News
Sep 16, 2024 · It’s a move that’s enabling an increase in the capacity of the silicon side of the business, as well as the expansion of SiC and GaN capability. Nexperia’s Senior Director Product Management for SiC, Katrin Feurle, told Compound Semiconductor that most of the $200 million investment will be spent on new equipment and a remodelling of the ...
II-VI expands UK plant - News - Compound Semiconductor
Sep 29, 2021 · II-VI has announced a major expansion of its compound semiconductor fab in Newton Aycliffe, County Durham, UK, that will lead to the creation of a large number of jobs in the North East, UK. The company, which has its headquarters in Pennsylvania, is investing in its III-V compound semiconductor technology platform in the UK to sustain its ...
Hydro Leduc uses CISSOID’s SiC module - News
CISSOID, a power semiconductor solutions company, has announced that its SiC Inverter Control Module (ICM) has been adopted by Hydro Leduc, a manufacturer of hydraulic components, for its new electric Power Take-Off (ePTO), used in the electrification of trucks and other off-road vehicles. Hydro Leduc’s new ePTO solution offers an optimised ...