Kioxia plans to raise as much as $3 billion via a dollar bond sale that would be its first corporate debt issuance, in the ...

Kioxia and YMTC are pioneering the use of wafer bonding technologies— CMOS directly Bonded to Array (CBA) and Xtacking, ...

UFS Ver. 4.1 devices from the company integrate its innovative BiCS FLASH 3D flash memory and a controller in a JEDEC-standard package. These new UFS devices are built with KIOXIA's 8th-generation ...

KIOXIA-powered UFS Ver. 4.1 devices will bring big improvements to efficiency and performance for next-gen mobile devices ...

With a blend of speed and low power use, KIOXIA UFS Ver. 4.1 devices are built to enhance user experiences - enabling faster ...

Kioxia’s AiSAQ technology slashes AI inference costs by moving vector data off DRAM—pushing the boundaries of scalable RAG ...

In an ongoing effort to improve the usability of AI vector database searches within retrieval-augmented generation (RAG) ...

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UFS 4.1 flash memory devices meet the demands of next-generation mobile applications, including advanced smartphones with ...

KIOXIA has updated its impressive AiSAQ software for AI systems which leverages the flexible nature of high-speed SSD storage ...

Kioxia Corporation, a world leader in memory solutions, today announced that it has begun sampling new Universal Flash ...