High-bandwidth memory (HBM) sales are spiking as the amount of data that needs to be processed quickly by state-of-the-art AI ...

Panel-level packaging offers scalability and cost efficiency, but meeting advanced node process targets remains a formidable ...

Challenges and options vary widely depending on markets, workloads, and economics.

A discussion with Jay Vleeschhouwer of Griffin Securities on EDA's continued consolidation, expansion into engineering ...

UCIe helps test through a fixed shoreline, multiple redundant lanes, and mission mode lane performance monitoring.

Device design begins with the anticipated workload. What is it actually supposed to do? What resources — computational units, ...

Why microarchitectures and custom coding on low-cost chips are a growing source of concern.

Factors that impact mask lifetime, the future role of actinic inspection, and minimum mask dimensions for high-NA EUV.

Researchers from Queen Mary University of London created biodegradable, flexible, and electrically conductive nanocomposite ...

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how ...

While memory catches up, the AI industry has focused on a new model type, the Small Language Model (SLM). Like LLMs, SLMs are ...

A new IEEE technical paper titled “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing” ...