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Tech Xplore on MSN3D chip stacking method created to overcome traditional semiconductor limitationsA novel power supply technology for 3D-integrated chips has been developed by employing a three-dimensionally stacked ...
This week’s 3DExpress is full of exciting developments. First, we cover the world’s first femur transplant that succeeded with the help of a 3D printed femur. Then, we take a look at new ...
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