Machine learning is a mathematical construct that is the foundation for nearly all the advancements in AI. ML came first, but ...

Why have wafer shipments remained flat while AI semiconductor demand is booming and fab investments are rising?

Fig. 1: Modeling qubits in a realistic way involves large-scale atomistic models with possibly amorphous materials, disorder, ...

Today, there are still many ways for defects to slip through final testing and get shipped to customers. However, in-line ...

Narrowly defined verticals offer the best opportunities for AI. Plus, what will the impact be on junior engineers?

Advanced packaging often relies on silicon interposers to connect chiplets and other components inside a package. The problem is that interposers typically exceed the reticle limit, which adds both ...

A new technical paper titled “Architecting Long-Context LLM Acceleration with Packing-Prefetch Scheduler and Ultra-Large ...

After nearly three decades, the era of copper interconnects may be coming to an end. Sort of. At interconnect CDs below 10nm, copper is no longer the best metallization choice. Yet it remains ...

A new technical paper titled “Ultra Ethernet’s Design Principles and Architectural Innovations” was published by researchers ...

Time-of-flight sensors; manufacturing quantum chips; collaboration for growth; wafer shipment conundrum; sparse linear ...

A new technical paper titled “Physical Design Exploration of a Wire-Friendly Domain-Specific Processor for Angstrom-Era Nodes ...

Book: Using predictive analytics and heterogeneous package workflows to design cost-effective multi-die assemblies.