The AR4HT Series CSP sockets accept any area-array device for high-temperature testing up to 200°C and incorporate a low-profile 0.45-mm contact structure (compressed) that is shorter than other ...
TE Connectivity recently unveiled its extra-large array (XLA) socket technology, which provides more reliable performance with 78% better warpage control than traditional molded socket technologies.
Galileo is a test socket engineered to support today’s high performance Digital and RF applications. It leverages proven interposer elastomer technology and advanced 3D printing manufacturing to ...
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