The AR4HT Series CSP sockets accept any area-array device for high-temperature testing up to 200°C and incorporate a low-profile 0.45-mm contact structure (compressed) that is shorter than other ...

TE Connectivity recently unveiled its extra-large array (XLA) socket technology, which provides more reliable performance with 78% better warpage control than traditional molded socket technologies.

Galileo is a test socket engineered to support today’s high performance Digital and RF applications. It leverages proven interposer elastomer technology and advanced 3D printing manufacturing to ...

AMD has a track record of supporting each successive platform for multiple generations, in stark contrast to the tick-tock cadence kept by its rival Intel. The AM4 platform is still being supported, ...