At SEDEX 2024 in Seoul, Samsung Electronics, SK Hynix, and Intel showcased advanced packaging technologies as essential for future semiconductor innovations. With a focus on AI and next-gen computing, ...
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Samsung accelerates race against Intel in glass chip packaging development — glass substrates boost performanceAs Samsung Foundry tries to land more orders from developers of data center-grade processors, the company needs to offer advanced packaging services as well. To that end, the glass substrates ...
Jeong Gi-tae, vice president of Samsung Electronics' foundry business unit, recently revealed the development roadmap for the company's wafer foundry technology at an industry-academic exchange ...
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