The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...

The elastic modulus relates the applied stress to the strain it produces. In a material that obeys Hooke's Law, the initial uniaxial elastic response is linear with stress and strain coupled through ...

Introduction​ The manufacturing sector has always been plagued by spring design failures as the main factor causing machinery to vibrate more than normal and th ...

When a material experiences an applied uniaxial tensile stress, s, it displays a strain response, e. In the initial stage of strain, the response is linear in the stress and may be described by ...